Sumitomo Bakelite Expands China Chip Packaging Materials Output

The Tokyo-based company will add production lines for mould underfill (MUF) materials and compression-moulding granules at its facilities in Suzhou, China, and Singapore.

The expansion is expected to roughly double the company’s production capacity for MUF materials and triple that for compression-moulding granules compared with current levels.

Production is scheduled to begin in fiscal 2030 in Suzhou and at the end of fiscal 2028 in Singapore.